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Double-sided photoelectrolytic copper foil 6μm ~ 15μm
Double-sided photoelectrolytic copper foil has the characteristics of symmetrical double-sided structure, metal density close to the theoretical copper density, extremely low surface profile, high elongation and tensile strength, and high elongation and tensile strength. At the same time, double-sided photoelectrolytic copper foil, as the negative electrode current collector of lithium batteries, has good resistance to cold and thermal expansion, which can significantly extend the life of the battery. can...
RTF reversed copper foil
Reversed copper foil is a polished copper foil, which has good etchability, effectively reduces the manufacturing process, speeds up and quickly etches, and can improve the yield of printed circuit boards. It is mainly used in multilayer boards and high-frequency boards. ...
VLP Ultra Low Profile Copper Foil
It can provide ultra-low roughness electrolytic copper foil. Compared with general electrolytic copper foil, the crystal of VLP copper foil is more delicate, is equiaxed crystal, does not contain columnar crystals, and has flat edges and a surface roughness of 0.55 microns. It has better dimensional stability and higher hardness. Suitable for high frequency and high speed materials, mainly used for flexible circuit boards, high frequency circuit boards and ...
LP low profile copper foil
It is mainly used for multi-layer printed circuit boards and high-density circuit boards. It requires copper foil surface roughness to be smaller than ordinary copper foil, and maintains a high level of properties such as anti-peel strength. Electrolytic copper foil. Compared with general electrolytic copper foil, the crystal of LP copper foil is very delicate (...
HTE high temperature extended electrolytic copper foil
NORD has developed fine grain, low surface roughness, high strength, high temperature and high ductility copper foil. The copper foil has uniform and fine grains, has a high elongation, and prevents cracks caused by thermal stress. It is suitable for The inner and outer layers of the multilayer board; the surface roughness is low, and it has excellent etchability, which can be used for high density and thinning. Refined printed circuit board; tensile strength non ...