网民彩票

LP low profile copper foil
2018-07-09

It is mainly used for multi-layer printed circuit boards and high-density circuit boards. It requires copper foil surface roughness to be smaller than ordinary copper foil, and maintains a high level of properties such as anti-peel strength. It belongs to a special class of thickness control. Electrolytic copper foil. Compared with general electrolytic copper foil, the crystals of LP copper foil are very delicate (<2 / zm), are equiaxed grains, do not contain columnar crystals, are lamellar crystals, and have flat edges and low surface roughness. It has better dimensional stability and higher hardness.